Laser annealing apparatus, TFT device and annealing method of the same

ABSTRACT

A laser beam is concentrated using an objective lens and radiated on a amorphous silicon film or polycrystalline silicon film having a grain size of one micron or less, the laser beam being processed from a continuous wave laser beam (1) to be pulsed using an EO modulator and to have arbitrary temporal energy change while pulsing ; (2) to have an arbitrary spatial energy distribution using a beam-homogenizer, filter having an arbitrary transmittance distribution, and rectangular slit; and (3) to eliminate coherency thereof using a high-speed rotating diffuser. In this manner, it is possible to realize a liquid crystal display device in which a driving circuit comprising a polycrystalline silicon film having substantially the same properties as a single crystal is incorporated in a TFT panel device.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a laser annealing method and laser annealing apparatus which are optimal for the improvement of film qualities, crystal grain enlargement, or Single-crystallization through laser beam irradiation of a amorphous or polycrystalline semiconductor film formed on an insulating substrate; [and further relate] to a TFT device manufactured through laser annealing and a display apparatus provided such a TFT device.

[0003] 2. Description of the Related Art

[0004] Currently, liquid crystal panels form images by switching thin film transistors formed with a amorphous or polycrystalline silicon film on a substrate of glass or fused quartz. Significant reductions in production costs and improvements in reliability could be expected if it were possible to form a driver circuit for driving the pixel transistor on the substrate at the same time.

[0005] However, because the silicon film forming the active layer of the transistors has poor crystallinity, the capacity of thin film transistors as represented by mobility is low and the manufacture of circuits for which high speeds and high-performance are required is difficult. A high mobility thin film transistor is required in order to manufacture these high-speed, high performance circuits; and in order to realize this, improvements in the crystallinity of the silicon thin film are necessary.

[0006] Excimer laser annealing has in the past garnered attention as a method for improving crystallinity. In this method, mobility is improved by changing the amorphous silicon film to a polycrystalline silicon film, by irradiating an excimer laser on a amorphous silicon film formed on an insulating substrate of glass or the like. However, the polycrystalline film attained by excimer laser irradiation has crystal grain sizes of several hundred nanometers. The film does not have the performance to be applied as a driver circuit or the like for driving a liquid crystal panel.

[0007] In order to resolve this issue, the following method is disclosed in Japanese Patent Laid-open Application No. 2001-44120, wherein crystal grain sizes are increased by irradiation with an ultraviolet pulsed laser, an excimer laser for example, which is a first pulsed laser, followed by irradiation with a pulsed laser in the visible light range, which is a second pulsed laser. This method contrives to increase crystal grain sizes by extending the re-crystallization time with the radiation of the second pulsed laser within 200 nanoseconds of irradiation with the first pulse laser.

SUMMARY OF THE INVENTION

[0008] In the abovementioned background art, the harmonics of a Q-switched oscillating solid-state laser, with an Nd ion-doped or Yb ion-doped crystal or glass excitation medium, is used as the second pulsed laser: Nd:YAG laser, Nd:YLF laser, Yb:YAG laser, Nd:glass laser, or Yb:glass laser.

[0009] However, the pulse duration of these lasers is several dozen to several hundred nanoseconds and the extension of the re-crystallization time is limited. Specifically, the crystal grain sizes attained are about one micron, and still do not have sufficient capacity for application as a driver circuit or the like for driving a liquid crystal panel. Also, an attenuator and linear beam-forming optical system are shown as the optical system for irradiating the second pulsed laser in the abovementioned background art, but the following problems remain just from [the use of] this mechanism.

[0010] The first problem is that the output of the Q-switched oscillating pulse changes in terms of time in the form of a sine wave, and the pulse duration and change in output in terms of time, which are optimal for annealing, cannot be attained.

[0011] The second problem is that the energy distribution of the abovementioned labor is a Gaussian distribution. In this state, the uniform energy distribution necessary for laser annealing, or the [energy distribution] optimal for annealing is not attained.

[0012] Furthermore, the third problem is that a laser beam from a solid-state laser such as an Nd:YAG laser has high coherency. Irregularities occur in the energy density distribution in the irradiated area as a result of the influence of this interference.

[0013] It is an object of the present invention to resolve these abovementioned problems with the background art and to provide a laser annealing method and laser annealing apparatus, optimal for the annealing of an amorphous or polycrystalline silicon thin film, having the energy distribution appropriate for laser annealing in the irradiated area without the influence of interference, wherein the optimal temporal energy changes are attained in laser annealing with the optimal pulse duration; and to provide a TFT device manufactured through laser annealing.

[0014] In order to achieve the abovementioned objects, the laser annealing method relating to the present invention radiates a laser beam processed by the following means. Firstly, an oscillator, whereby a continuous wave beam is attained, is used as the laser oscillator in order to realize the desired pulse duration and desired temporal energy changes. The continuous wave laser beam is pulsed and the preferred change in terms of time for the energy of the pulsed laser beam is attained with time varying means such as an electro-optical modulator or acoustic-optical modulator.

[0015] Secondly, the coherency of the laser beam having coherency is eliminated or reduced with an incoherent optical system, and the influence of interference on the laser-irradiated area is reduced or eliminated.

[0016] Thirdly, a beam-homogenizer and rectangular slit are used to provide a uniform energy distribution across the entire surface of the irradiated area; and a filter having the desired transmittance distribution is provided in order to give the specific distribution. A laser beam, for which the uniform or desired energy distribution is attained, is irradiated on a amorphous or polycrystalline silicon film as a projected image of the rectangular slit image with an objective lens.

[0017] Also, in order to achieve the abovementioned object, the laser annealing apparatus relating to the present invention comprises: a laser oscillator outputting a continuous wave beam; means for modulating the laser in terms of time; a beam-homogenizer; an incoherent optical system; a filter having the desired transmittance distribution; a rectangular slit; and an objective lens.

[0018] Furthermore, the TFT device relating to the present invention is attained by performing the abovementioned laser annealing method relating to the present invention with the abovementioned laser annealing apparatus relating to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0019] These and other features, objects and advantages of the present invention will become more apparent from the following description when taken in conjunction with the accompanying drawings wherein:

[0020]FIG. 1 is a front view showing the constitution of the laser annealing apparatus relating to a first embodiment;

[0021]FIG. 2 is an inclined view of an EO modulator used in the first embodiment;

[0022]FIG. 3 is an inclined view of the EO modulator used in the first embodiment;

[0023]FIG. 4 is a graph showing the relationship between the applied voltage and transmittance in the EO modulator;

[0024]FIG. 5 is a graph showing the relationship between the laser input, applied voltage, and laser output in the EO modulator;

[0025]FIG. 6 is a plan view of a continuously variable transmittance filter used in the first embodiment;

[0026]FIG. 7 is a graph showing the relationship between the angle of incidence and reflectance of the P polarized light;

[0027]FIG. 8 is a plan view of a continuously variable transmittance filter using a plurality of transparent substrates and used in the first embodiment;

[0028]FIG. 9 is a graph showing a cross sectional view of the front of the beam-homogenizer in the first embodiment, and a graph showing the energy distribution of the incoming and outgoing light;

[0029]FIG. 10 is a plan view of the front of the kaleidoscope in the first embodiment and a graph of the energy distribution of incoming and outgoing light;

[0030]FIG. 11 is a front view showing the physical relationship between the rectangular slit and objective lens in the first embodiment;

[0031]FIG. 12 is a graph showing the energy distribution in the case of projecting a coherent laser beam, in the laser annealing apparatus relating to the first embodiment;

[0032]FIG. 13 is an inclined view of a substrate to explain the procedures of the laser annealing method relating to the first embodiment;

[0033]FIG. 14 is a schematic for explaining the processing of the TFT display apparatus following annealing;

[0034]FIG. 15 is a plan view showing the state of the crystal before performing the annealing method relating to the first embodiment;

[0035]FIG. 16 is a plan view showing the state of the crystal after performing the annealing method relating to the first embodiment;

[0036]FIG. 17 is an inclined view showing the constitution of the laser annealing apparatus relating to a second embodiment;

[0037]FIG. 18 is an inclined view showing the constitution of the laser radiating optical system in the laser annealing apparatus relating to a third embodiment;

[0038]FIG. 19 is a plan view of a substrate showing the physical relationship between the region where the laser annealing method was performed and the active region of the driving circuit;

[0039]FIG. 20 is a plan view of a substrate showing the constitution of a transistor for a driving circuit formed by performing the laser annealing method;

[0040]FIG. 21 is an explanatory drawing showing the energy distribution and change in terms of time of the energy of the laser beam irradiated in the laser annealing method;

[0041]FIG. 22 is a plan view of a substrate to explain the scanning method in the laser annealing method relating to another embodiment;

[0042]FIG. 23 is a plan view of a substrate to explain the scanning method in the laser annealing method relating to another embodiment;

[0043]FIG. 24 is a flow chart showing the process for manufacturing a liquid crystal display apparatus wherein the laser annealing method is applied;

[0044]FIG. 25 is a flow chart showing the laser annealing process; and

[0045]FIG. 26 is an inclined view showing an applied sample of a liquid crystal display apparatus constituted with the TFT device wherein the laser annealing is applied.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0046] Following is a detailed explanation of the present invention using the drawings. FIG. 1 is a drawing showing the constitution of the laser annealing apparatus relating to the first embodiment of the present invention, and is constituted with the following elements disposed on a bed 1 which is provided a vibration proofing mechanism (not shown): a laser oscillator 3 for emitting a continuous wave laser beam 2, a shutter 4 for turning the laser beam 2 on and off, a beam expander 5 for expanding the beam diameter of the laser beam 2 output from the laser oscillator 3, an electro-optical modulator (hereinafter “EO modulator”) 6 for realizing the pulsing and temporal modulation of the energy of the laser beam 2, a continuously variable transmittance ND filter 7 for regulating the energy of the laser beam 2, a beam-homogenizer 8 for giving the laser beam 2 a uniform energy distribution, a cylindrical lens 9 for compressing the laser beam 2 in one direction and forming a linear beam, a reference light source 10 for confirming the radiation area and radiation form of the laser beam 2, a dichroic mirror 11 having the property of transmitting the wavelength from the reference light source 10 and reflecting the laser beam 2, a diffusing panel 13 which is provided a high-speed rotary driving apparatus 12, a filter 14 for providing the desired form to the energy density distribution in the irradiated surface, a rectangular slit 15 for eliminating the spillover portion of the laser beam 2 and forming the given rectangular form, a mirror 17 for combining the illuminating beam, laser beam 2, and reference beam, an illuminating light source 18 used during observation, a CCD camera 19, a laser cut filter 20 for preventing the laser beam from irradiating on the CCD camera 19, a monitor 22 for displaying the sample surface imaged by the CCD camera 19, an auto-focusing optical system 24 for detecting the focal position and outputting a signal in the case of deviation from the focal position, an objective lens 25 used in observation and for concentrating the laser beam 2, a stage 28 for supporting the sample 26 and moving [the sample] to XYZθ directions, a power monitor 29 fixed on the stage 28 and for measuring the output of the laser beam 2, a beam profiler 30 for measuring the two dimensional energy distribution of the laser beam 2, and a control PC (control apparatus) 31 for controlling the stage 28, laser oscillator 3, shutter 4, EO modulator 6, continuously variable transmittance filter 7, electromotive rectangular slit 15, a Z stage according to a signal from the auto-focusing optical system 24, and an image processing unit and the like (not shown).

[0047] Next, the operation and functions of each portion are explained in detail. The bed 1 is preferably provided a vibration proofing mechanism (not shown) using an air spring in order to damp vibrations from the floor. The vibration proofing mechanism may be unnecessary depending on the environment where [the apparatus] is installed. Sufficient strength and rigidity are provided for supporting the stage 28 and various optical systems.

[0048] The continuous wave laser beam 2 preferably has a wavelength that is absorbed by the amorphous or polycrystalline silicon thin film which is subject to annealing, specifically a wavelength from the ultraviolet to the visible wavelengths. More specifically, the following may be applied: an Ar laser or Kr laser and the second harmonics thereof, the second and third harmonics of an Nd:YAG laser, Nd:YVO₄ laser, and Nd:YLF laser. However, in consideration of the magnitude and stability of the output, the second harmonics (wavelength 532 nm) of an LD (laser diode) pumped Nd:YAG laser or the second harmonics (wavelength 532 nm) of an laser diode pumped Nd:YVO₄ laser are preferable. The following explanation concerns the case of using the second harmonics of the LD pumped Nd:YVO₄ laser which has a high output power and superior stability and low noise properties.

[0049] The laser beam 2 oscillated from the laser oscillator 3 is switched on and off with the shutter 3 [sic]. Specifically, the laser oscillator 3 is placed in a state of continually oscillating the laser beam 2 at a constant output; the shutter 4 is normally off and the laser beam 2 is blocked by the shutter 4. This shutter 3 [sic] is opened (on state) only when the laser beam 2 is to be radiated, and the laser beam 2 is output. It is possible to turn the laser beam on and off by turning the pumping laser diode on and off, but this is not desirable for ensuring the stability of the laser output. In addition, in view of safety, the shutter 4 may be closed when the radiation of the laser beam 2 is to be stopped.

[0050] The laser beam 2 which passes through the shutter 4 has its beam diameter expanded by the beam expander 5 and strikes the EO modulator 6. In consideration of the damage threshold of the EO modulator 6, the beam diameter is expanded by the beam expander 5 up to a size approaching the effective diameter of the EO modulator 6. When the beam diameter of the laser beam 2 oscillated from the laser oscillator 3 is about 2 mm and the effective diameter of the EO modulator 6 is 15 mm, the expansion factor of the beam expander 5 is about 6. Of course, the beam expander 5 need not be used when the damage threshold of the EO modulator 6 is sufficient high for direct irradiation by the laser beam 2 from the laser oscillator 3.

[0051] As shown in FIGS. 2 and 3, the EO modulator 6 uses a combination of a Pockels cell 61 (hereinafter “crystal”) and a polarized beam splitter 62. In the case where the laser beam 2 is a linearly polarized beam as shown in FIG. 2, [the laser beam 2] strikes the polarized beam splitter 62 as an S polarized beam and is deflected 90 degrees, without the rotation of the polarization direction of the laser beam 2 which passes through the crystal 61, when the voltage V1 (normally a voltage of 0 V) is applied through a driver (not shown) to the crystal 61. Specifically, in this state, the laser beam 2 is in an off state and does not reach the downstream optical systems because the laser beam 2 is output at a deflection of 90 degrees.

[0052] Next, as shown in FIG. 3, with the application of the voltage V2 which can cause the rotation by 90 degrees of the polarization direction of the laser beam 2 transmitted by the crystal 61, [the laser beam 2] reaches the polarized beam splitter 62 as a P polarized beam, and the laser beam 2 undergoes rectilinear propagation through the polarized beam splitter 62. Specifically, in this state, the laser beam 2 is in an on state and undergoes rectilinear propagation to the downstream optical systems.

[0053] Furthermore, as shown in FIG. 4, by regulating the voltage applied to the crystal 61 between V1 (normally 0 V) and V2, the transmittance of the laser beam 2 transmitted by the EO modulator 6 can be regulated as desired between T1 (normally 0) and T2 (this is the maximum transmittance, specifically 1). In other words, the transmittance of the laser beam 2 transmitted by the EO modulator 6 can be regulated as desired from 0 to 1. However, it is assumed here that there is no reflection or absorption by the surfaces of the crystal 61 and polarized beam splitter 62.

[0054] Because of this, as shown in FIG. 5, the output of the laser beam 2 striking the EO modulator 6 (input to the EO modulator 6) is uniformly P0. By applying stepped voltage to the crystal 61 between V1, V2, V3, and V1, a stepped output of P2 and P3 is attained from the EO modulator 6. Here, the output P2 is found as the product of the input P0 to the EO modulator 6 and the transmittance T2 when voltage, V2 is applied; P3 is found as the product of P0 and the transmittance T3 when the voltage V3 is applied.

[0055] The output of the transmitted laser beam 2 can be continually varied by continually changing the voltage applied to the crystal 61. As a result, it becomes possible to attain a pulsed laser beam 2 having the preferred change in terms of time.

[0056] This explanation concerned the combination of a Pockels cell 61 and a polarized beam splitter 62 as the EO modulator 6, but various types of polarized beam elements can be used. Moreover, in the following explanation, the combination of the crystal 61 and polarized beam splitter 62 (or various types of polarized beam elements) is referred to as the “EO modulator 6”.

[0057] Besides the EO modulator, it is also possible to use an AO (acoustic-optical) modulator. Generally, however, an AO modulator has a lower driving frequency than an EO modulator, and therefore is not applicable to the case where high-speed rising and falling are required and of extracting a pulsed beam with a small pulse duration. In this way, using a modulator such as the EO modulator 6 or an AO modulator makes it possible to attain a pulsed laser beam having the desired waveform (temporal energy change) with the desired pulse duration from a continuous wave laser beam. In other words possible, it is possible to perform the desired time modulation.

[0058] The continuously variable transmittance ND filter 7 has the purpose of regulating the output of the laser beam 2 irradiating the sample 26 and preferably has continuously variable transmittance. Also, in FIG. 1, [the filter 7] is placed after the EO modulator 6, but when damage threshold is high enough, [the filter 7] may also be placed before the EO modulator 6 if the direction of polarization is not rotated or the linearly polarized light is not disrupted when transmittance is varied. The continuously variable transmittance ND filter 7 having the constitution shown in FIG. 6 is used here. This has plates which are transparent to the wavelength of the laser beam 2, for example the quartz plates 71 and 72, placed symmetrically to a plane 74 which is perpendicular to the optical axis 73. The incident angle is varied while the symmetrical relationship is maintained, and the quantity of the transmitted laser beam is varied.

[0059] When adjusted so that the linearly polarized laser beam 2 radiates on the quartz plates 71 and 72 as P polarized light, the angle of incidence and reflectance at the interface change as shown in FIG. 7. The transmittance T can be expressed as T=1−R when the reflectance at the interface is R. The reflectance is 0, and therefore the transmittance becomes 1 when the angle of incidence is the Brewster angle, meaning the angle attained as tan⁻¹ (N) where the index of refraction of the quartz plates 71 and 72 is N. As the angle of incidence increases, the reflectance increases and transmittance decreases; when the angle of incidence is 90 degrees, reflectance becomes 1 and therefore transmittance becomes 0.

[0060] Accordingly, the desired reflectance is attained by varying the angle of incidence between the Brewster angle and 90 degrees. In the constitution shown in FIG. 6, there are four interfaces between the air and the quartz. As a result, the overall transmittance T becomes the transmittance at the interface raised to the power of 4, T4=(1−R)⁴.

[0061] Because of the size limit when there is a single plate (quartz plate), a transmittance of a few percent is the limit, realistically, because it is not possible to make the angle of incidence be 90 degrees. However, a low transmittance can be easily attained by exponentially varying the number of interfaces between the quartz and the air. As shown in FIG. 8, there are 12 interfaces when the constitution has three quartz plates 71, 71′, 71″, 72, 72′, 72″. As a result the transmittance T12 is expressed as T12 =(1−R)¹² and the transmittance is effectively decreased without making the angle of incidence very large. Actually, it is not possible to make the angle of incidence be 90 degrees, and a transmittance on the order of 0.05 (5%) is easily attained when the quartz plates are made sufficiently large so the transmittance can be continuously varied between 5 and 100%.

[0062] Moreover, there is sometimes influence from reflection from the rear surfaces in the case of using a regular quartz plate, but this can be countered by applying an anti-reflective coating on one surface of the quartz plate. Also, in the case of using a plurality of quartz plates, there is sometimes influence from reflection from adjacent quartz plates, but this can be countered by sufficiently increasing the space between the quartz plates.

[0063] In addition, in the case where the diameter of the laser beam 2 is small, it is possible to use an ND filter formed of a metal thin film or a dielectric multilayer film so that transmittance is continuously varied in the plane of the transparent substrate. Also, where it is not possible to continuously vary transmittance, the object of the invention can be substantially attained by sequentially switching among ND filters with different transmittances, or with a combination of multiple ND filters having various transmittances. Naturally, it is possible to regulate the laser output by controlling the current of the laser-pumping laser diodes, but this is not preferable because of issues such as requiring a certain amount of time until output becomes stable, in the case of changing output.

[0064] A gas laser or solid-state laser normally has the Gaussian energy distribution as shown in FIG. 9, and therefore [such a laser] cannot be used without alteration to the laser annealing relating to the present invention. If the oscillator output is sufficiently large, the beam diameter is sufficiently wide and a uniform energy distribution can be attained by extracting only the comparatively uniform portion in the center. However, the peripheral portion of the beam is eliminated and a large part of the energy is wasted.

[0065] The beam-homogenizer 8 is used in order to resolve this defect and to convert the Gaussian distribution into a uniform distribution. As shown with one example in FIG. 9, this is a combination of a fly eye lens 81, constituted with a two-dimensional array of rod lenses, and a convex lens 82. The output beam is converted to a beam having a uniform distribution. Apart from the fly eye lens 81, the same effects are attained with a combination of two cylindrical lens arrays, such that the axes of the cylindrical lenses intersect, with a convex lens.

[0066] The output beam from the beam-homogenizer 8 is concentrated in only one direction with a cylindrical lens 9 and thereby a linear beam with a uniform energy distribution (but having a Gaussian distribution in the widthwise direction) can be finally attained at the rectangular slit surface. That which is constituted of the fly eye lens 81 (or combination of cylindrical lens arrays), the convex lens 82, and the cylindrical lens 9, so as to form a linear beam with a uniform energy distribution, may also be used as the beam-homogenizer.

[0067] Otherwise, a constitution for concentrating [the beam] in a rectangular or a line form may be established with the disposition of a plurality of fly eye lenses or a cylindrical lens array. The point is that a laser beam having a Gaussian distribution can be converted to a rectangular or a line beam having a uniform energy density distribution.

[0068] In addition, as shown in FIG. 10, it is also possible to use a kaleidoscope wherein the laser beam 2 is concentrated with a lens 84 and enters a hollow tube 85, and the output distribution is made uniform by multiple reflection within the tube 85. In this case, a rectangular or line laser beam 2 having a uniform energy density distribution is attained by the continuous conversion therein, such that the laser beam 2 is round where it enters, but rectangular or line shaped beam where it exits. Otherwise, a prism may be used wherein the laser beam 2 is split into a plurality [of beams] which are overlapped with each other.

[0069] As shown in FIG. 11, the spillover portion is eliminated with the electronic rectangular slit 15 from the rectangular or line beam attained as necessary, and formed in a rectangular or line shape of the required dimensions. There is no problem even if the spillover remains, and the electromotive rectangular slit 15 may be released and allow the entirety of the laser beam 2 to pass there through. This laser beam 2 is radiated so as to be projected on the surface of the sample 26 by the objective lens 25. When the magnification of the objective lens 25 is M, the size of the image of the electromotive rectangular slit 15, or the laser beam 2 at the surface of the electromotive rectangular slit 15 is the inverse of the magnification, meaning 1/M.

[0070] However, even if the laser passing through the electromotive rectangular slit 15 has a uniform energy distribution, and even if the laser beam 2 having coherency such as a regular YVO₄ laser beam is formed in a rectangle by the rectangular slit 15 and strikes the surface of the sample 26, an interference pattern determined by the wavelength of the laser beam 2 and the NA of the objective lens 25 occurs under the influence of diffraction at the edge of the rectangular slit 15, and the distribution becomes irregular as shown in FIG. 12. Furthermore, even when the energy density is partly uniform, a speckle pattern occurs from the influence of interference.

[0071] In order to eliminate these irregularities, a diffuser 13 is inserted in the optical path. This diffuser 13 is formed of a quartz substrate, the surface of which has irregular variations of 1000 to 2000 mesh. Simply put, the insertion of the diffuser 13 itself has no effects, but when the diffuser 13 is caused to rotate at a high speed by the high-speed rotation driving apparatus 12, the laser beam 2 is diffused in random directions in terms of time and the length of the optical path and direction of travel to the surface of the sample 26 are randomly varied.

[0072] The laser beam 2 is diffused in various directions during the time in which one pulse of the laser beam 2 is completed. Consequently, because the length of the optical path to the surface of the sample is varied, irregularities in energy density occurring as a result of interference are canceled and coherency is reduced. As a result, as shown by the broken line in FIG. 12, a projected image having a geometrically uniform energy density distribution is attained.

[0073] When the pulse duration of the radiated laser beam 2 is 10 microseconds, and the laser beam is transmitted through a portion 50 mm distant from the center of the diffuser 13, the diffuser 13 moves 300 microns during the period of one pulse where the diffuser 13 is rotated at a speed of 6000 revolutions per minute. When a 1000 to 2000 mesh plate is used as the diffuser 13, random variations with a period of 8 to 16 microns are formed. Because each portion of the laser beam transmitted passes through 20 or more variations on average, the influence of interference can be sufficiently canceled and the coherency of the laser beam is reduced.

[0074] Moreover, depending on the object, a more specific energy density distribution than the uniform energy density distribution may be desired, for example: a distribution having a slope in a crosswise direction of the line beam, or a distribution where the energy density is low in the central portion and high in the peripheral portion in the widthwise direction of the linearly formed beam. In those cases, the object can be achieved by inserting a filter 14 having the specific transmittance distribution in the optical path that of the electromotive rectangular slit 15.

[0075] Likewise, a phase plate (for example, a glass substrate formed with random spots of thick SiO₂ film where the phase varies by 0, π/2 radians, π radians, 3π/2 radians) may be used instead of the diffuser and be caused to rotate at high speeds like the diffuser. Otherwise, a vibrating element may be mounted on the mirror 150 or 151, for bending the laser beam by 90 degrees in the constitution shown in FIG. 1, and caused to vibrate at a high frequency, or more preferably caused to vibrate at a frequency synchronized with the timing (corresponding to the pulse duration) in which the laser beam is radiated, whereby the length of the optical path of the laser beam 2 is varied and the effects of interference can be canceled.

[0076] To radiate the laser beam 2 on the sample 26, the stage 28 is driven within the XY plane, while the laser beam 2 is radiated in pulses to the desired location. However, when displacement from the focal position occurs because of surface irregularities or waviness on the sample 26, changes in the energy density and deterioration of the radiated form occur and the object cannot be achieved. For this reason, to make possible the continual irradiation of the focal position, control is performed to detect the focal position with an auto focusing optical system 24 and, in the event of displacement from the focal position, to drive the stage 28 in the Z direction (height) so as to be continually at the focal position.

[0077] The surface of the sample 26 irradiated with the laser beam 2 can be imaged by the CCD camera 19 with the incident light from the illuminating light source 18 and observed with the monitor 22. In the case of observation during laser radiation, a laser cut filter 20 is inserted ahead of the CCD camera 19, and prevents halation of the CCD camera 19 with the laser light reflected by the surface of the sample 26 and prevents damage to [the camera].

[0078] A power meter 29 for measuring the output power of the laser beam 2 irradiating the sample 26, and a beam profiler 30 for measuring the energy density distribution are disposed on the stage 28. As necessary, the laser output and energy distribution (profile) can be measured by moving the stage 28 and positioning the light collecting portions of the abovementioned power meter 29 or beam profiler 30 at the optical axis in a state of being directly below the objective lens 25 or apart from the objective lens 25.

[0079] Because of the low damage threshold for the light collecting portions, attenuation is necessary for the measurement of beam profile so that the energy density distribution does not change. For this reason, an attenuation filter (not shown) may be inserted in the optical path. When a plurality of attenuation filters are inserted, reflected light is reflected again between the filters, overlaps the transmitted light, and disrupts the profile in many cases. As a result, [the filters] are not inserted perpendicular to the optical axis, but may be inclined with respect to a plane perpendicular to the optical axis, and with a large space between the filters.

[0080] For the alignment of the sample 26, an alignment mark or specific pattern on the sample 26 is formed in several locations with the objective lens 25 and CCD camera 19, and processing of each is performed by image processing units(not shown). The positions of the center of gravity of the alignment marks are detected and [alignment] can be performed with respect to the XY? 3 axis moving the stage 28.

[0081] In FIG. 1, a single objective lens 25 is shown, but a plurality of objective lenses may be the installed on an electromotive revolver, and the optimal objective lens for a process can be used by switching [lenses] according to a signal from the control apparatus 31. Specifically, the objective lens appropriate for each of the following [processes] can be used: rough alignment when loading the sample 26, fine alignment when necessary, the laser annealing process, observation after processing, and the formation of alignment marks as discussed below. Naturally it is also possible to establish a separate optical system (lens, imaging apparatus, and lighting apparatus) for alignment, but the alignment precision can be improved with detection on the same optical axis by having the optical system for laser annealing double as the alignment optical system.

[0082] The laser annealing method, which is one embodiment of the present invention and is performed using the abovementioned laser annealing apparatus relating to the present invention, is explained next using FIG. 13. As shown in FIG. 13A, a polycrystalline silicon thin film substrate 100 [with the following constitution] is used as the sample 26: an amorphous silicon thin film is formed on the principle plane of the glass substrate 101 with an insulating thin film 102 therebetween, and is crystallized into a polycrystalline silicon thin film 103 by the scanning of the entire surface with an excimer laser beam. The insulating thin film 102 is SiO₂, SiN, or a composite film thereof. The polycrystalline silicon thin film substrate 100 is placed on the stage 28.

[0083] As shown in FIG. 13A, alignment marks 104, 104′ are formed in two locations on this polycrystalline silicon thin film substrate 100. These alignment marks 104, 104′ are usually formed with a photo-etching technique, but it is very wasteful to perform a photo-resist process just for this purpose. For this reason, cross-shaped marks can be formed as the alignment marks 104, 104′ by successively irradiating with the laser beam 2 used for laser annealing into horizontal and vertical rectangles, for example, by the electromotive rectangular slit 15, and removing the polycrystalline silicon thin film therewith. In this case, the energy density is naturally set higher than in the case of performing annealing.

[0084] While the stage 28 or optical system is caused to move as shown in FIG. 13B, according to the design coordinates based on the alignment marks 104, 104′, the objective lens 25 concentrates a laser beam 105 for annealing, having the given pulse waveform through the EO modulator 6, given the desired energy distribution by the homogenizer 8 and filter 14, and which has lost its coherency by passing through the diffuser 13 which is rotating at a high speed.

[0085] The irradiated region is the portion where a driver circuit is formed for driving each pixel, for example. While the polycrystalline silicon thin film substrate 100 is moved relatively as necessary and is passed back and forth a plurality of times, the necessary portions only are successively irradiated. According to the constitution of the apparatus, relative scanning may also be performed by moving the optical system.

[0086] More specifically, the laser beam 105 having the energy density distribution as shown in FIG. 21A is irradiated. The crosswise energy density distribution is sloped as shown in FIG. 21B, and the energy density becomes high in the scanning direction. Also, the lengthwise energy density distribution becomes the uniform energy density distribution as shown in FIG. 21C. Also, the pulse waveform becomes the waveform as shown in FIG. 21D, which has a uniform energy for an initial uniform period of time and thereafter decreases linearly.

[0087] The size of the irradiated region is established in a 500 micrometer by 20 micrometer rectangle, for example. This size is determined by the output of the laser oscillator 3; a larger region can be irradiated if oscillation at a sufficiently high output is possible. The crosswise energy density shown in FIG. 21B is set so as to vary linearly by 20% in size from the forward energy density to the opposite side in the scanning direction.

[0088] Also, as shown in FIG. 21D, the irradiation time (pulse duration) of the laser beam 105 is set so as to have a constant energy for the first 10 microseconds and then decrease linearly for the next five microseconds. While the polycrystalline silicon thin film substrate 100 is moved relatively at a speed of 100 mm per second, [the laser beam] is radiated at a 25 micrometer pitch. Thereby, a laser irradiated region of 500 micrometers by 20 micrometers (In view of the distance moved during the abovementioned 15 microsecond laser radiation time, this is a 500 micrometer by 21.5 micrometer laser irradiation region in a stricter sense) is formed at a 25 micrometer pitch.

[0089] To radiate the laser beam of 105 at a precise 25 micrometer pitch, the distance traveled by the stage 28 or polycrystalline silicon thin film substrate 100 may be detected and the EO modulator caused to operate at a 25 micrometer movement. More specifically, a distance measuring apparatus such as a linear encoder or linear scale (not shown) may be established on the stage 28 whereon is disposed the polycrystalline silicon thin film substrate 100, or a rotary encoder may be established on the drive shaft of the stage 28. The encoder output pulses corresponding to the 25 micrometer movement may be counted, and a trigger signal to drive the EO modulator emitted.

[0090] In this system, radiation at a precise 25 micrometer pitch is possible even if the speed of the stage 28 varies somewhat. Naturally, while the laser beam 105 is being radiated, the stage 28 preferably moves at a constant speed. In the case of moving at a constant speed, the EO modulator may also be driven for at a constant time interval (in the abovementioned case, a 250 microsecond interval). However, in view of speed variations and irregularities of the stage 28, it is clearly more desirable to have a system for detecting the distance traveled.

[0091] As shown in FIG. 15, a polycrystalline silicon thin film 103 is used in the present embodiment as the substrate annealed with the excimer laser. The polycrystalline silicon thin film 103 attained by annealing with the excimer laser is an aggregate of small crystal grains 120, 121 with crystal grain sizes of no more than one micron (several hundred nanometers). When the region shown in the drawing is irradiated with a laser beam, the fine crystal grain 120 outside the laser irradiation region remains in its present state, but the fine crystal grains (for example, crystal grain 121) within the laser irradiation region are melted.

[0092] Thereafter, with the laser energy being reduced or radiation being stopped, the melted silicon forms crystals growing from the low temperature side to the high temperature side and having the same crystal orientation as the seed crystals along the temperature gradient, where the seed crystals are crystal grains which remain at the edges of the molten region. The growth speed of the crystal grains at this time varies depending on the crystal orientation, and therefore only the crystal grains having the crystal orientation with a faster growth speed ultimately remain. Specifically, as shown in FIG. 16, the crystal grain 122, having the crystal orientation with a slow growth speed, is suppressed by the growth of surrounding crystal grains having a crystal orientation with a faster growth speed, and the crystal growth is stopped.

[0093] Also, crystal grains 123 and 124, having the crystal orientation with a moderate growth speed continue to grow, but are suppressed by the growth of crystal grains with a higher growth speed and before long, their growth stops. Finally, only crystal grains 125, 126, and 127 having the crystal orientation with the fastest growth speed continue to grow. These crystal grains 125, 126, and 127 which continue to grow to the end are individual crystal grains in a strict sense, but have mostly the same crystal orientation. The melted and re-crystallized portion can effectively be viewed as a single crystal.

[0094] By radiating the laser beam on the polycrystalline silicon thin film 103 as discussed above, only the part of the polycrystalline silicon thin film 103 irradiated with the laser beam 105 is annealed like an island as shown in FIG. 13C, only the crystal grains having a specific crystal orientation are formed and are in a polycrystalline state in a strict sense. However, regions 106 having a nearly single crystal character are formed. In particular, this may substantially be considered as a single crystal in the direction which does not cross the crystal grain boundaries.

[0095] By repeating these procedures and radiating the laser 105 successively on portions requiring annealing during relative scanning of the polycrystalline silicon thin film substrate 100, regions to form a transistor of a driver circuit are all converted to regions 106 having a nearly single crystal character. Furthermore, because the crystal grains grow in a uniform direction in the regions 106 having a nearly single crystal character as shown in FIG. 16, the flow of current across the crystal grain boundaries can be avoided by matching the direction in which current flows with the direction of crystal grain growth when the transistor is formed.

[0096] The direction in which the crystal grains grow can be controlled by the energy density distribution of the irradiated laser beam 105 and the scanning direction of the laser beam (actually, the scanning direction of the stage). Specifically, as shown in FIG. 21B, when a slope is provided to the energy density distribution, the crystal grains began re-crystallizing from where energy density is low (low temperature side) and grow towards where energy density is high (high temperature side).

[0097] Also, with the scanning of the laser beam 105, the temperature drops from the portion outside the irradiated region, re-crystallization begins, and crystals grow in the scanning direction of the laser beam. With the present embodiment, crystal grains are attained which grow greater than the 1 micrometer crystal grain sizes from annealing with an excimer laser in the crosswise direction, and which grow to 10 micrometers or greater in the lengthwise direction.

[0098] Also, in the laser irradiated region 301 as shown in FIG. 19, portions constituted only of crystal grains with a high growth speed may be positioned to become the active layers (active regions) 302, 303 of a driving transistor. Through diffusing an impurities-implantation process and a photo-etching process, [portions] outside of the active regions 302, 303 are removed. With a photo-etching process as shown in FIG. 20, a gate electrode 305 over a gate insulating film, a source electrode 306 and a drain electrode 306 [sic-307] having ohmic connections are formed, and the transistor is completed. Crystal grain boundaries 304, 304′ are present in the active region 303. However, because current flows between the source electrode 306 and drain electrode 307, current does not cross the crystal grain boundaries 304, 304′ and mobility substantially equivalent to the case of constitution with a single crystal is attained.

[0099] As mentioned above, by matching the direction of the flow of current with the direction that does not cross crystal boundaries for portions which were melted and re-crystallized with laser annealing according to the present invention, the mobility can be improved to double or more that of the polycrystalline silicon thin film 103 which only underwent annealing with an excimer laser. This mobility is a value sufficient for the formation of a liquid crystal driver circuit which can drive at a high speed.

[0100] On the other hand, pixel switching transistors are formed in the region of the polycrystalline silicon thin film 103 which only underwent annealing with an excimer laser. Because the crystal grains are fine and are randomly oriented in the polycrystalline film attained by annealing with the excimer laser, the mobility is low compared to that of the crystal grains attained by laser annealing with the present invention, but is sufficient for used in pixel switching transistors.

[0101] In some cases, even amorphous silicon film is sufficient for use as a pixel switching transistor. In that case, annealing with an excimer laser is limited to only portions for forming the driving circuit, and the laser annealing method according to the present invention may be performed thereafter.

[0102] The procedures discussed above can be collected in the flow charts shown in FIGS. 24 and 25. Specifically, insulating film formation and a-Si film formation are performed on the substrate, and after excimer laser annealing, laser annealing according to the present invention is performed for only those portions for forming the driving circuit.

[0103] To explain laser annealing according to the present invention in more detail, a substrate which underwent excimer laser annealing with the procedures shown in FIG. 25 is loaded in the laser annealing apparatus relating to the present invention, pre-alignment is performed at the substrate edge or corner, and an alignment mark is formed by laser processing. After the alignment mark is detected and alignment (fine alignment) is performed, laser annealing is performed for only those portions forming the driving circuit according to the design data. In the case where the alignment mark is formed with a photo-resist process at the point in time when the [substrate] is loaded in the laser annealing apparatus, the pre-alignment and alignment mark forming processes are not necessary. The substrate is transported after repetition until the desired region is entirely annealed.

[0104] Afterwards, as shown in the flow chart in FIG. 24, islands of polycrystalline silicon film remain at only portions where necessary, based on the alignment marks 104, 104′ or on the origin coordinate calculated from the alignment marks 104, 104′, through a photo-etching process. Thereafter, gate insulating film formation and gate electrode formation are performed with a photo-resist process, and then impurities implantation and the activation of the implanted impurities are performed.

[0105] Afterwards, through photo-resist processes such as interlayer insulating film formation, source and drain electrode formation, protective film (passivation film) formation, the driving circuits 107, 107′ and a pixel 109 are formed on the polycrystalline silicon thin film substrate 100 as shown in FIG. 14A, and a TFT device is completed. Moreover, after the laser annealing according to the present invention is performed, the alignment marks 104, 104′ are used for positioning in at least one photo-resist process. Thereafter, newly formed alignment marks may be used in the abovementioned photo-resist processes.

[0106] Afterwards, through an LCD process (panel process) for laying a color filter 109 on the TFT device, through processes such as orientation film formation and rubbing, and sealing liquid crystal material therein as shown in FIG. 14B, and a module process for placement in a chassis 110 together with a back light (not shown) or the like as shown in FIG. 14C, a liquid crystal display device having a high-speed driver circuit is completed.

[0107] Examples of products including the liquid crystal display apparatus manufactured with the application of laser annealing according to the present invention include the following: the display portion of the liquid crystal television 401 as shown in FIG. 26A, the display portion of the portable telephone 402 as shown in FIG. 26B, or the display portion of the notebook computer 403 as shown in FIG. 26C, in addition to the display portion of various types of instruments included in an automobile dashboard, as well as the display portion of a portable game device.

[0108] Next, another embodiment of the laser annealing apparatus relating to the present invention is explained using FIG. 17. The present embodiment comprises: a stage 202 whereon is loaded a large substrate 201 from which a plurality of panels 200, 200′, 200″ can be acquired; a plurality of optical lens barrels 203, 203′, 203″ provided to the laser radiating optical system, an adjustment stage 204 (the adjustment stages for optical lens barrels 203′, 203″ are not shown) for independently adjusting the position of each of the abovementioned optical lens barrels; and a rack 205 (partially shown in this drawing) for holding the abovementioned adjustment stage 204.

[0109] As shown in FIG. 18, a laser radiating optical system comprising the following is contained within the optical lens barrels 203: a laser oscillator 210, shutter 211, beam expander 212, EO modulator 213, beam-homogenizer 214, high-speed rotating diffuser 215, rectangular slit 216, objective lens 217, CCD camera 218, and a filter 219 for attaining the desired energy density distribution. Moreover, the basic constitution is that shown in FIG. 1, although the following are omitted from FIG. 18: an illuminating apparatus for observation, a light source apparatus for the reference beam, an observation monitor, a high-speed rotating mechanism for the diffuser, an auto-focusing optical system, an image processing unit, a control apparatus, and so forth.

[0110] The functions of each portion are the same as for the laser annealing apparatus shown in FIG. 1 and are not touched upon in detail here. Different aspects are as follows: a plurality of groups (three groups in FIG. 17) of the laser radiating optical systems are each contained within individual optical lens barrels 203, 203′, 203″; each of those is fixed on the adjustment stage 204 which can be moved independently in the XYZ [directions]; position adjustment is possible so that each optical lens barrel 203, 203′, 203″ can radiate a laser beam at the same position on each panel, and laser annealing can be performed for a plurality of locations at the same time.

[0111] The laser annealing method with the abovementioned laser annealing apparatus is explained next. As shown in FIG. 13A, the substrate 201 used is a substrate having the same constitution as the polycrystalline silicon thin film substrate 100, wherein a amorphous silicon thin film is formed on the principle surface of the glass substrate 101 with an insulating thin film 102 therebetween, and the amorphous silicon thin film 103 is re-crystallized by scanning an excimer laser over the entire surface. The insulating thin film 102 is SiO₂, SiN, or a composite thereof. A plurality of panels may be formed on the polycrystalline silicon thin film substrate 201 (three panels are formed on one substrate in FIG. 17).

[0112] The substrate 201 is loaded on the stage 202. Alignment marks (not shown) are formed in a plurality of locations in the regions where each panel 200, 200′, 200″ will be formed on this polycrystalline silicon thin film substrate 201. These alignment marks are normally formed with a photo-etching technique, and it is wasteful to perform a photo-resist process just for this purpose.

[0113] For this reason, after detecting the corners of the polycrystalline silicon thin film substrate 201 and performing a rough alignment, cross shaped marks are formed as alignment marks at a plurality of locations on each panel 200, 200′, 200″ successively by forming the laser beam, used for laser annealing from one optical lens barrel (for example, 203), with the rectangular slit 216 into vertical and horizontal rectangles, for example, and removing the polycrystalline silicon thin film. Otherwise, after positioning each of the optical lens barrels 203, 203′, 203″ to predetermined standard positions, cross shaped marks are formed as alignment marks at a plurality of locations 203, 203′, 203″ [sic].

[0114] Next, alignment marks in two locations are successively imaged with the CCD camera 218 on one optical lens barrel (for example, 203), the center of gravity position thereof is detected, and fine alignment of the substrate 201 is performed by moving the stage 202 by the XY?3 axis according to the design coordinates, based on the alignment marks. Moreover, the CCD camera of the optical lens barrel for performing annealing is used for detecting the alignment marks, but an alignment optical system may be additionally installed. In this case, a plurality of alignment marks may be detected successively with a single optical system, or a plurality of alignment marks may be detected at the same time with a plurality of optical systems.

[0115] Afterwards, the stage 202 is moved is so that the location of each of the alignment marks for each panel 200, 200′, 200″ enters the field of view of each optical lens barrel according to the design coordinates. The alignment marks are imaged the CCD camera 218 of each optical lens barrel 203, 203′, 203″, and [the positions are] adjusted with the adjustment stage 204 of each optical lens barrel 203, 203′, 203″ so that the center of gravity matches the center of viewing field. The position of each of the optical lens barrels 203, 203′, 203″ is thereby adjusted so as to irradiate the same location on the panels 200, 200′, 200″ formed on the substrate 201.

[0116] Thereafter, the laser beam irradiates and anneals only those portions where the active layer (active region) of the driving circuit is to be formed on each panel 200, 200′, 200″ according to the design data as discussed above.

[0117] As discussed above, the laser beam radiated has the given pulse waveform due to the EO modulator 213 and the desired energy density distribution due to the homogenizer 214 and transmittive filter as necessary, is diffused by passing through the high-speed rotating diffuser 215, loses coherency, is formed in a rectangle by the rectangular slit 216, and is concentrated and radiated by the objective lens 217. As necessary, the output from the homogenizer 214 is constituted so as to be formed in a rectangular or line beam.

[0118] The region irradiated with the laser beam is the portion for forming the driver circuit for driving each pixel, for example. Only the necessary portions are successively irradiated as the stage 202 is moved and the polycrystalline silicon thin film substrate 201 is scanned. At this time, each optical lens barrel 203, 203′, 203″ is controlled with the auto focusing mechanism (not shown), by the independent movement in the Z direction of the adjustment stage 204 whereon each optical lens barrel 203, 203′, 203″ is loaded, so that all of the objective lenses have a constant physical relationship to the surface of the substrate 201.

[0119] When a large number of small panels are arrayed on single substrate, annealing can be performed for all panels by performing annealing every several panels, moving by a distance of one panel, and repeating the annealing procedures once more. Specifically, as shown in FIG. 22A, [this is] explained for the case where nine rows panels are formed on the substrate 251 and annealed with three optical lens barrels.

[0120] Annealing is performed every three rows from the right side of the substrate 251 with the three optical lens barrels 250, 250′, 250″. When annealing is finished for the first, fourth, and seventh rows of panels and the melted and re-crystallized regions 252, 252′, 252″ are formed, then the substrate 251 is moved to the right by one row, or the set of optical lens barrels 250, 250′, 250″ are moved to the left by one row, as shown in FIG. 22B and the second, fifth, and eighth rows of panels are annealed.

[0121] After being further moved by a distance of one panel in the same way, annealing of the third, sixth, and ninth rows of panels is performed and annealing of the substrate 251 is ended. As necessary, in the case of scanning at right angles to the scanning direction pictured, the substrate 251 may be rotated 90 degrees, the widthwise and lengthwise direction of the laser beam switched, and the scanning direction changed.

[0122] In the case of changing the scanning direction, as shown in FIG. 23A, three panels in the first column of panels are annealed from the right of the substrate 251 with each of the optical lens barrels 250, 250′, 250″, and the melted and re-crystallized regions 254, 254′, 254″ are formed. Next, as shown in FIG. 23B, the stage or the optical lens barrels are moved by a distance of one panel in a direction perpendicular to the scanning direction and three panels in the second column of panels are annealed. This procedure is repeated as many times as necessary, all panels are annealed, and then [the process] is ended.

[0123] As explained with FIG. 15, the polycrystalline silicon film formed on the substrate 201 is an aggregate of fine crystal grains of one micron or less (several hundred nanometers). When the laser is radiated on this fine crystal grain aggregate, fine crystal grains outside the laser irradiated region remain in their present state, but the fine crystal grains within the laser irradiated region are melted. Thereafter, crystals having the crystal orientation of seed crystals grow in the melted silicon film, with the seed crystals being the remaining crystal grains at the periphery of the melted region.

[0124] Because the growth speed of crystal grains at this time varies depending on the crystal orientation, only those crystal grains having the crystal orientation with the fastest growth speed ultimately remain. Specifically, as shown in FIG. 16, the crystal grain 122, having the crystal orientation with a slow growth speed, is suppressed by the growth of crystal grains having a crystal orientation with a faster growth speed, and the crystal growth is stopped. Also, crystal grains 123 and 124, having the crystal orientation with a moderate growth speed continue to grow, but are suppressed by the growth of crystal grains 125, 126, and 127 with a high growth speed and before long, their formation stops. Finally, only crystal grains 125, 126, and 127 having the crystal orientation with the fast growth speed continue to grow.

[0125] These crystal grains 125, 126, and 127 which continue to grow to the end are individual crystal grains in a strict sense, but have mostly the same crystal orientation. The melted and re-crystallized portion can effectively be viewed as a single crystal. Specifically, as shown in FIG. 13C, only the part of the polycrystalline silicon thin film 103 irradiated with the laser beam 105 is annealed like an island and is in a polycrystalline state in a strict sense. However, regions 106 having a nearly single crystal character are formed.

[0126] By repeating these procedures while scanning the substrate 201 and successively radiating the laser beam on portions requiring annealing, regions to form a transistor of a driver circuit can all be converted to regions having a nearly single crystal character. Furthermore, because the crystal grains grow in a uniform direction in the regions having a nearly single crystal character as shown in FIG. 16, the flow of current across the crystal grain boundaries can be avoided by matching the direction in which current flows with the direction of crystal grain growth when the transistor is formed.

[0127] The direction in which the crystal grains grow can be controlled by the energy density distribution of the radiated laser beam and the scanning direction of the laser beam (actually, the scanning direction of the stage). Specifically, when a slope is provided to the energy density distribution, crystallization begins from where energy density is low (low temperature side) and [the crystals] grow towards where energy density is high (high temperature side).

[0128] Also, the irradiated region moves because the laser beam is scanned and the drop in temperature begins from the portion which is separated from the irradiated region. Therefore crystallization begins and crystals grow in the scanning direction of the laser beam. With the present embodiment, crystal grains can be attained which grow greater than the 1 micrometer crystal grain sizes from annealing with an excimer laser in the crosswise direction, and which grow to 10 micrometers or greater in the lengthwise direction. Also, crystal grains of 10 micrometers or greater can be attained.

[0129] In the laser irradiated region 301 as shown in FIG. 19, portions constituted only of crystal grains with a high growth speed may be positioned to become the active layers (active regions) 302, 303 of a driving transistor. Through an impurity implantation process and a photo-etching process, [portions] outside of the active regions 302, 303 are removed. With a photo-resist process as shown in FIG. 20, a gate electrode 305 over a gate insulating film, a source electrode 306 and a drain electrode 307 having an ohmic connection are formed, and the transistor is completed.

[0130] Crystal grain boundaries 304, 304′ are present in the active region 303. However, because current flows between the source electrode 306 and drain electrode 307, current does not cross the crystal grain boundaries 304, 304′ and mobility substantially equivalent to the case of constitution with a single crystal is attained. Specifically, the mobility of the melted and re-crystallized portion can be improved to double or more that of the polycrystalline silicon thin film which only underwent excimer laser annealing. Thereby, a liquid crystal driver circuit which can drive at high speeds can be formed on the TFT device.

[0131] Moreover, the transistor shown in FIG. 20 is only one example and [the present invention] is not limited thereto. The transistors can have various different structures, but it is clearly possible to form transistors having various structures which do not depart from the substance of the present invention.

[0132] On the other hand, pixel switching transistors are formed in the region of the polycrystalline silicon thin film 103 which only underwent annealing with an excimer laser. Specifically, a TFT device is completed through photo-resist processes such as gate insulating film formation, gate electrode formation, impurities implantation, activation of implanted regions, source and drain electrode formation, passivation film formation, and based on the alignment marks or on the origin coordinates calculated from the alignment marks. The alignment marks formed by laser processing as alignment marks for the photo-resist process are used for positioning in at least one photo-resist process. Thereafter, newly formed alignment marks may be used in the abovementioned photo-resist processes.

[0133] Afterwards, through an LCD (panel) process for forming an orientation film on the completed TFT device, and laying a color filter and sealing liquid crystal material therein on the TFT device through a rubbing process, and a module process for placement in a chassis together with a back light or the like, a liquid crystal display device having a high-speed driver circuit formed on the glass substrate is completed (a so-called system on panel or system in display).

[0134] As explained above, the laser annealing apparatus and laser annealing method relating to the present invention have the effects of being able to cause crystal grains of a amorphous or polycrystalline silicon thin film to grow in the desired direction, to convert [such a film] to a polycrystalline silicon thin film comprising crystal grains of a size greater than 10 microns, and to greatly improve the mobility of the polycrystalline silicon thin film, by radiating a laser beam without influence from interference, having a suitable energy density distribution for annealing the irradiated portion, and having the optimal pulse duration and the suitable temporal energy change for annealing.

[0135] Also, the TFT device relating to the present invention has the effects of making possible the creation of a high speed driving circuit on a substrate and the realization of a so-called system on panel or system in display.

[0136] While we have shown and described several embodiments in accordance with our invention, it should be understood that disclosed embodiments are susceptible of changes and modifications without departing from the scope of the invention. Therefore, we do not intend to be bound by the details shown and described herein, but intend to cover all such changes and modifications that fall within the ambit of the appended claims. 

What is claimed is:
 1. A laser annealing apparatus comprising: stage means that are movable in a state supporting a sample; laser beam source means for emitting a laser beam; modulation means for modulating in terms of time the energy of the laser beam emitted from the laser beam source means; energy distribution adjusting means for adjusting said laser beam, emitted from the laser beam source means, to have desired spatial energy distribution; coherency reducing means for reducing the coherency of said laser beam emitted from the laser beam source means; and projecting optical system means for projecting onto the surface of said sample the laser beam which has passed through said modulating means, said energy distribution adjusting means, and said coherency reducing means.
 2. A laser annealing apparatus comprising: stage means that are movable in a state supporting a sample; laser beam source means for emitting a laser beam; modulation means for modulating in terms of time the energy of the laser beam emitted from the laser beam source means; shaping means for shaping the cross sectional form of said laser beam emitted from the laser beam source means; coherency reducing means for reducing the coherency of said laser beam emitted from the laser beam source means; and projecting optical system means for projecting onto the surface of said sample the laser beam which has passed through said modulating means, said forming means, and said coherency reducing means.
 3. A laser annealing apparatus comprising: stage means that are movable in a state supporting a sample; laser beam source means for emitting a laser beam; modulation means for modulating the energy of the laser beam emitted from the laser beam source means and passed through said shutter means within a time period when said shutter means are on; energy distribution adjusting means for adjusting said laser beam emitted from the laser beam source means to have desired spatial energy distribution; coherency reducing means for reducing the coherency of said laser beam emitted from the laser beam source means and Projecting optical system means for projecting onto the surface of said sample the laser beam which has passed through said modulating means, said energy distribution adjusting means, and said coherency reducing means.
 4. A laser annealing apparatus comprising: stage means that are movable in a state supporting a sample; laser beam source means for emitting a laser beam; modulation means for modulating in terms of time the energy of the laser beam emitted from the laser beam source means and passed through said shutter means; energy distribution adjusting means for adjusting the spatial energy distribution of said laser beam emitted from the laser beam source means; and projecting optical system means for projecting onto the surface of said sample the laser beam which has passed through said modulating means and said energy distribution adjusting means.
 5. The laser annealing apparatus according to claim 1, wherein the modulating means for modulating said laser beam in terms of time are an electro-optical modulator.
 6. The laser annealing apparatus according to claim 1, wherein said energy distribution controlling means comprise a beam-homogenizer, a filter having desired transmittance distribution, and a rectangular slit.
 7. The laser annealing apparatus according to claim 1, wherein said coherency reducing means are a diffuser rotating at a high speed.
 8. The laser annealing apparatus according to claim 1, wherein said laser beam source means generate second harmonics of YVO₄ laser.
 9. The laser annealing apparatus according to claim 1, further comprising an auto focusing mechanism for controlling the relationship between the focal position of said projecting optical system and said sample surface.
 10. A laser annealing method for annealing a thin film formed on the surface of a sample by: modulating in terms of time the energy of a laser beam emitted from a laser beam source; adjusting the energy distribution of the laser beam the energy of which has been modulated; and radiating said laser beam the energy of which has been modulated in terms of time and said energy distribution of which has been adjusted, so as to scan the surface of the sample having the thin film formed on the surface.
 11. A laser annealing method for annealing a desired region of a thin film on the surface of a sample by: modulating in terms of time the energy of a laser beam emitted from a laser beam source; shaping the cross sectional form of the laser beam the energy of which has been modulated; and radiating said laser beam the energy of which has been modulated in terms of time and the cross sectional form of which has been shaped, so as to scan the surface of the sample having the thin film formed on the surface.
 12. A laser annealing method for partially annealing a thin film on the surface of a sample by: modulating in terms of time the energy of a laser beam emitted from a laser beam source; adjusting the energy distribution of the laser beam the energy of which has been modulated in terms of time; and intermittently radiating the laser beam the energy of which has been modulated in terms of time and said energy distribution of which has been adjusted, over the surface of the sample having the thin film formed on the surface.
 13. The laser annealing method according to claim 10, wherein said laser beam is modulated in terms of time using an electro-optical modulator.
 14. The laser annealing method according to claim 10, wherein said laser beam energy distribution is adjusted using a beam-homogenizer, a filter having desired transmittance distribution, and a rectangular slit.
 15. A laser annealing method comprising: converting a continuous laser beam to a pulsed laser beam having a desired waveform using time modulating means; converting said pulsed laser beam to a laser beam having desired energy distribution using spatial modulating means; concentrating said laser beam having the desired energy distribution; and radiating the concentrated laser beam only over desired regions while scanning relatively over the amorphous or polycrystalline silicon film, formed on a glass substrate with an insulating film interposed therebetween.
 16. A laser annealing method comprising: converting a continuous laser beam to a pulsed laser beam having a desired waveform using time modulating means; converting said pulsed laser beam to a laser beam having desired energy distribution using spatial modulating means; concentrating the laser beam after reducing the coherency of said laser beam using an incoherent optical system; and radiating the concentrated laser beam only over desired regions while scanning relatively over the amorphous or polycrystalline silicon film, formed on a glass substrate with an insulating film interposed therebetween.
 17. A laser annealing method comprising: a process for radiating an excimer laser over the entire surface of a amorphous silicon film formed on a glass substrate with an insulating film interposed therebetween, and converting said amorphous silicon film to a polycrystalline silicon film; and a process for radiating a laser beam which has been to a rectangular or linear laser beam having a desired pulse waveform and desired energy distribution, only over the regions for forming a driving circuit.
 18. A laser annealing method comprising: a process for radiating an excimer laser over the entire surface of a amorphous silicon film formed on a glass substrate with an insulating film interposed therebetween, and converting said amorphous silicon film to a polycrystalline silicon film; a process for radiating a laser beam at a plurality of locations on said polycrystalline silicon film and forming alignment marks; and a process for detecting said alignment marks and, based on the position of said alignment marks, radiating a laser beam which has been to a rectangular or linear laser beam having the desired pulse waveform and desired energy distribution, only over the regions for forming a driving circuit; wherein said alignment marks are used for positioning in at least one downstream photo-resist process.
 19. A TFT device having a pixel portion and a driving circuit portion formed on a glass substrate; wherein at least the active layer (active region) of a transistor constituting said driving circuit comprises polycrystalline silicon including crystals that do not have crystal grain boundaries which cross the direction of current flow.
 20. A TFT device having a pixel portion and a driving circuit portion formed on a glass substrate; wherein the active layer (active region) of a switching transistor forming said pixel portion comprises amorphous or polycrystalline silicon; and the polycrystalline silicon of the active region of a transistor constituting said driving circuit has a crystal grain size greater than that of the amorphous silicon or polycrystalline silicon constituting the active layer (active region) of said switching transistor.
 21. A TFT device comprising a pixel portion and a driving circuit portion, formed in the surrounding of the pixel portion, on a glass substrate having a polycrystalline silicon film formed thereon; wherein the gate electrode, source electrode, and drain electrode of a transistor constituting said driving circuit are disposed on the same silicon crystal grain. 